发明申请
- 专利标题： System and methods for measuring chemical concentrations of a plating solution
- 专利标题（中）： 用于测量电镀溶液化学浓度的系统和方法
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申请号： US11189368申请日： 2005-07-26
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公开(公告)号： US20070026529A1公开(公告)日： 2007-02-01
- 发明人: Alexander Hoermann , Yevgeniy Rabinovich , Kathryn Ta
- 申请人： Alexander Hoermann , Yevgeniy Rabinovich , Kathryn Ta
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： G01N27/00
- IPC分类号： G01N27/00
摘要：
An electrochemical plating system, which includes one or more plating cell reservoirs for storing plating solution and a chemical analyzer in fluidic communication with the one or more plating cell reservoirs. The chemical analyzer is configured to measure chemical concentrations of the plating solution. The plating system further includes a plumbing system configured to facilitate the fluidic communication between the one or more plating cell reservoirs and the chemical analyzer and to substantially isolate the chemical analyzer from electrical noise generated by one or more plating cells of the one or more plating cell reservoirs.
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