发明申请
- 专利标题: Substrate processing apparatus and substrate processing method
- 专利标题(中): 基板加工装置及基板处理方法
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申请号: US11493190申请日: 2006-07-26
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公开(公告)号: US20070028437A1公开(公告)日: 2007-02-08
- 发明人: Masahiro Kimura , Seiichiro Okuda
- 申请人: Masahiro Kimura , Seiichiro Okuda
- 专利权人: DAINIPPON SCREEN MFG. CO., LTD.
- 当前专利权人: DAINIPPON SCREEN MFG. CO., LTD.
- 优先权: JPJP2005-218490 20050728; JPJP2006-084404 20060327
- 主分类号: B21D31/00
- IPC分类号: B21D31/00
摘要:
A substrate processing apparatus flows a propagation liquid for propagating ultrasonic vibrations, and controls the flow rate thereof. The ultrasonic vibrations are scattered by the flow of the propagation liquid, so that a concentrated impact of the ultrasonic vibrations given on a substrate is relieved. The substrate processing apparatus can increase the output power of ultrasonic vibrations by controlling the flow rate of the propagation liquid while preventing a fine pattern formed on the substrate from stripping or falling down.