发明申请
US20070028437A1 Substrate processing apparatus and substrate processing method 审中-公开
基板加工装置及基板处理方法

Substrate processing apparatus and substrate processing method
摘要:
A substrate processing apparatus flows a propagation liquid for propagating ultrasonic vibrations, and controls the flow rate thereof. The ultrasonic vibrations are scattered by the flow of the propagation liquid, so that a concentrated impact of the ultrasonic vibrations given on a substrate is relieved. The substrate processing apparatus can increase the output power of ultrasonic vibrations by controlling the flow rate of the propagation liquid while preventing a fine pattern formed on the substrate from stripping or falling down.
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