发明申请
- 专利标题： System and Device For Thinning Wafers That Have Contact Bumps
- 专利标题（中）： 具有接触碰撞的薄化晶片的系统和器件
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申请号： US11533609申请日： 2006-10-17
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公开(公告)号： US20070029045A1公开(公告)日： 2007-02-08
- 发明人: Timothy Krywanczyk , Edmund Sprogis
- 申请人： Timothy Krywanczyk , Edmund Sprogis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/306
- IPC分类号： H01L21/306
摘要：
In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.
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