Invention Application
US20070029572A1 LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method
审中-公开
具有改善的焊接结构的LED，将LED焊接到PCB的方法以及通过该方法制造的LED组件
- Patent Title: LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method
- Patent Title (中): 具有改善的焊接结构的LED，将LED焊接到PCB的方法以及通过该方法制造的LED组件
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Application No.: US11497233Application Date: 2006-08-02
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Publication No.: US20070029572A1Publication Date: 2007-02-08
- Inventor: Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
- Applicant: Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2005-0070805 20050802
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.
Information query
IPC分类:
