发明申请
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US11497578申请日： 2006-08-02
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公开(公告)号： US20070029672A1公开(公告)日： 2007-02-08
- 发明人: Shuichi Tanaka
- 申请人： Shuichi Tanaka
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 优先权： JP2005-225452 20050803
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a straight line, and extending in a direction which intersects the straight line; and a plurality of electrical connection sections formed on the resin protrusions and electrically connected to the electrodes.
公开/授权文献
- US07576424B2 Semiconductor device 公开/授权日：2009-08-18
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