Invention Application
US20070034228A1 Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
审中-公开
用于在线处理的方法和装置，并且通过薄截面间隙中的粘性剪切立即顺序或同时处理平面和柔性基板，用于制造微电子电路或显示器
- Patent Title: Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
- Patent Title (中): 用于在线处理的方法和装置，并且通过薄截面间隙中的粘性剪切立即顺序或同时处理平面和柔性基板，用于制造微电子电路或显示器
-
Application No.: US11497526Application Date: 2006-08-02
-
Publication No.: US20070034228A1Publication Date: 2007-02-15
- Inventor: Andrew Devitt
- Applicant: Andrew Devitt
- Main IPC: B08B3/12
- IPC: B08B3/12 ; B08B3/00 ; B05D3/12
Abstract:
A method and apparatus for cleaning, drying, coating, baking etching and deposition of surfaces on glass substrate as it transitions thru and between small gaps between hydro-static porous media bearings. Due to the non-contact nature of the device extremely high pressures can be induced upon the work piece through various fluids without damage to the substrate, allowing the system to utilize the viscous nature of fluids to accomplish the desired cleaning, drying, coating, etching or baking. The process also allows for simultaneous and immediately sequential ordering of processes.
Information query
IPC分类:
