发明申请
US20070034882A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开
半导体发光器件

SEMICONDUCTOR LIGHT-EMITTING DEVICE
摘要:
An LED chip of the present invention includes a columnar GaP substrate in which a tapered portion whose outer shape is narrowed toward an upper bottom surface side is formed in an outer wall surface thereof, an upper-surface electrode provided in an upper bottom surface of the GaP substrate, a light-emitting layer provided in a lower bottom surface of the GaP substrate, and a lower-surface electrode provided in a surface opposite to the GaP substrate with respect to the light-emitting layer, the lower-surface electrode being arranged in an annular region outside the region opposite to the upper-surface electrode.
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