发明申请
- 专利标题： Techniques for providing decoupling capacitance
- 专利标题（中）： 提供去耦电容的技术
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申请号： US11201572申请日： 2005-08-11
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公开(公告)号： US20070035030A1公开(公告)日： 2007-02-15
- 发明人: Raymond Horton , John Knickerbocker , Edmund Sprogis , Cornelia Tsang
- 申请人： Raymond Horton , John Knickerbocker , Edmund Sprogis , Cornelia Tsang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
公开/授权文献
- US07435627B2 Techniques for providing decoupling capacitance 公开/授权日：2008-10-14