发明申请
US20070039436A1 Die cutting under vacuum through rollers 有权
在真空下通过滚筒进行模切

  • 专利标题: Die cutting under vacuum through rollers
  • 专利标题(中): 在真空下通过滚筒进行模切
  • 申请号: US11491885
    申请日: 2006-07-24
  • 公开(公告)号: US20070039436A1
    公开(公告)日: 2007-02-22
  • 发明人: James MayDavid Hunwick
  • 申请人: James MayDavid Hunwick
  • 优先权: CA2,513,158 20050725
  • 主分类号: B26D1/00
  • IPC分类号: B26D1/00 B26F1/14
Die cutting under vacuum through rollers
摘要:
In a process and apparatus for cutting a sheet material, one or more sheets of the material are placed over a die attached to a die board. A cutting pad is placed over the sheet material. Seals are placed around or between the die board and cutting pad to create an enclosure. A vacuum is created in the enclosure or between the die board and cutting pad so as to draw the die board and cutting pad together and compress the sheets of material. The resulting assembly is passed through a roller press to cut the sheets of material. A process or apparatus for mounting dies to a die board or stripping scrap from between dies and a quick release fastener are also described.
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