发明申请
- 专利标题: Double-sided metallic laminate and method for manufacturing the same
- 专利标题(中): 双面金属层压板及其制造方法
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申请号: US10550582申请日: 2004-03-25
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公开(公告)号: US20070042202A1公开(公告)日: 2007-02-22
- 发明人: Soon-yong Park , You-jin Kyung , Heon-sik Song , Byeong-in Ahn , Joo-eun Ko , Yong-jun Park , Se-myung Jang
- 申请人: Soon-yong Park , You-jin Kyung , Heon-sik Song , Byeong-in Ahn , Joo-eun Ko , Yong-jun Park , Se-myung Jang
- 申请人地址: KR Yeouido-Dong, Yeongdeungpo-Gu Seoul 150-721
- 专利权人: LG CHEM, LTD.
- 当前专利权人: LG CHEM, LTD.
- 当前专利权人地址: KR Yeouido-Dong, Yeongdeungpo-Gu Seoul 150-721
- 优先权: KR10-2003-0018811 20030326; KR10-2003-0018812 20030326
- 国际申请: PCT/KR04/00666 WO 20040325
- 主分类号: B32B15/08
- IPC分类号: B32B15/08
摘要:
The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.
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