发明申请
US20070042202A1 Double-sided metallic laminate and method for manufacturing the same 有权
双面金属层压板及其制造方法

Double-sided metallic laminate and method for manufacturing the same
摘要:
The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.
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