发明申请
- 专利标题： POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT
- 专利标题（中）： 阳离子光敏绝缘树脂组合物，固化产品和电子组件
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申请号： US11465671申请日： 2006-08-18
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公开(公告)号： US20070042296A1公开(公告)日： 2007-02-22
- 发明人: Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
- 申请人： Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
- 申请人地址： JP Chuo-ku
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Chuo-ku
- 优先权： JP2005-238853 20050819
- 主分类号： G03C1/00
- IPC分类号： G03C1/00
摘要：
Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.
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