发明申请
- 专利标题： Integrated electronic device and method of making the same
- 专利标题（中）： 集成电子设备及其制作方法
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申请号： US11509577申请日： 2006-08-25
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公开(公告)号： US20070045773A1公开(公告)日： 2007-03-01
- 发明人: Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
- 申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2005-252596 20050831
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/52 ; H01F27/28 ; H01F5/00
摘要：
An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
公开/授权文献
- US07948056B2 Integrated electronic device and method of making the same 公开/授权日：2011-05-24
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