An assembly (100) is provided which allows high power packaged power components (122) to operate at optimum power levels without degradation in performance. The assembly includes a heat sink (102), a printed circuit board (pcb) isolator (104) and a contact ring (106). The pcb isolator (104) provides electrical contacts (108, 128) upon which to mount the component and includes an opening (110) through which the component is soldered to the heat sink (102). The contact ring (106) is mounted to the pcb isolator (104) to form a cavity (124) within which the component (122) is contained. The assembly (100) can be coupled into a product having a chassis (320) and a product circuit board (324) such that the contact ring (106) is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation.