A heat-dissipating plate includes a heat-dissipating pad sandwiched between the first and second adhesive layers. The heat-dissipating pad is made from foam materials, and has a plurality of air passages formed through a peripheral surface thereof. The first adhesive layer is disposed on the peripheral surface of the heat-dissipating pad, and has a plurality of vents in spatial communication with the air passages in the heat-dissipating pad. The second adhesive layer is disposed on the peripheral surface of the heat-dissipating pad opposite to the first adhesive layer, and has a plurality of vents in spatial communication with the air passages in the heat-dissipating pad.