发明申请
US20070056403A1 Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material 审中-公开
导电细颗粒,导电细颗粒的制造方法和各向异性导电材料

  • 专利标题: Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material
  • 专利标题(中): 导电细颗粒,导电细颗粒的制造方法和各向异性导电材料
  • 申请号: US10567461
    申请日: 2005-07-14
  • 公开(公告)号: US20070056403A1
    公开(公告)日: 2007-03-15
  • 发明人: Takashi Kubota
  • 申请人: Takashi Kubota
  • 申请人地址: JP TOKYO
  • 专利权人: SONY CORPORATION
  • 当前专利权人: SONY CORPORATION
  • 当前专利权人地址: JP TOKYO
  • 优先权: JP2004-208914 20040715
  • 国际申请: PCT/JP05/13090 WO 20050714
  • 主分类号: B22F9/16
  • IPC分类号: B22F9/16
Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material
摘要:
The present invention aims to provide electroconductive fine particles having excellent electrical conductivity with fewer pinholes in a gold coating, a method of producing the electroconductive fine particles, which are cyan-free type with a plating bath excellent in stability, and an anisotropic electroconductive material using the electroconductive fine particles. The present invention is an electroconductive fine particle, which has a gold coating formed by electroless gold plating on the surface of a nickel undercoating, the amount of nickel dissolved in a dissolution test of the electroconductive fine particle with nitric acid being 30 to 100 μ/g; a method of producing the electroconductive fine particle, wherein the method allows a reducing agent, causing oxidation reaction on the surface of a nickel undercoating but not causing oxidation reaction on the surface of gold as deposited metal, to be present on the surface of the nickel undercoating thereby reduces a gold salt to deposit gold; and an anisotropic electroconductive material, which comprises the electroconductive fine particle dispersed in a resin binder.
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