A semiconductor laser module includes a laser holder, a semiconductor laser, a sleeve, an optical fiber, an annular member, and a flexible member. The laser holder has an end portion and is formed with a through-hole opened on the end portion. The semiconductor laser is provided on the laser holder and has a light-emitting portion for emitting a laser beam passing through the through-hole. The sleeve is fixed to the end portion so as to block the through-hole and is formed with an insertion hole. The optical fiber is disposed in the insertion hole and has an incident face. The laser beam is capable of entering the incident face. The annular member is provided on the end portion of the laser holder to encircle outside of the sleeve to be separated from the sleeve with a space between the annular member and the sleeve. The flexible member is affixed to the sleeve and the annular member for covering the space.