发明申请
- 专利标题： Metal and electronically conductive polymer transfer
- 专利标题（中）： 金属和电子导电聚合物转移
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申请号： US11227591申请日： 2005-09-15
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公开(公告)号： US20070059901A1公开(公告)日： 2007-03-15
- 发明人: Debasis Majumdar , Glen Irvin , Joseph Madathil , Lee Tutt , Gary Freedman , Robert Kress
- 申请人： Debasis Majumdar , Glen Irvin , Joseph Madathil , Lee Tutt , Gary Freedman , Robert Kress
- 专利权人： Eastman Kodak Company
- 当前专利权人： Eastman Kodak Company
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
The invention relates to a donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer.
公开/授权文献
- US07410825B2 Metal and electronically conductive polymer transfer 公开/授权日：2008-08-12