发明申请
- 专利标题： Supporting plate, apparatus, and method for stripping supporting plate
- 专利标题（中）： 支撑板支撑板，装置和方法
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申请号： US11512566申请日： 2006-08-30
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公开(公告)号： US20070062644A1公开(公告)日： 2007-03-22
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人地址： JP Kawasaki-shi
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2005-251200 20050831
- 主分类号： B29C63/00
- IPC分类号： B29C63/00
摘要：
A supporting plate which makes it possible to easily strip the supporting plate from a substrate in a short period of time after thinning the substrate. In the supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.