发明申请
- 专利标题： Light emitting diode package and method for manufacturing the same
- 专利标题（中）： 发光二极管封装及其制造方法
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申请号： US11524278申请日： 2006-09-21
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公开(公告)号： US20070063214A1公开(公告)日： 2007-03-22
- 发明人: Yong Kim , Seog Choi , Chang Lim , Yong Kim
- 申请人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2005-0088338 20050922
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
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