发明申请
US20070066187A1 Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization
审中-公开
包括抛光垫的化学机械抛光装置及其清洁方法以及用于平坦化的方法
- 专利标题： Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization
- 专利标题（中）： 包括抛光垫的化学机械抛光装置及其清洁方法以及用于平坦化的方法
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申请号： US11233564申请日： 2005-09-22
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公开(公告)号： US20070066187A1公开(公告)日： 2007-03-22
- 发明人: Chih-Chiang Yang , Peng-Yih Peng , Chin-Yung Liu , Chien-Fu Chu , Wen-Shan Lin , Chia-Yuan Hsieh
- 申请人： Chih-Chiang Yang , Peng-Yih Peng , Chin-Yung Liu , Chien-Fu Chu , Wen-Shan Lin , Chia-Yuan Hsieh
- 主分类号： B24B7/30
- IPC分类号： B24B7/30 ; B24B1/00 ; B24B29/00 ; B24B21/18
摘要：
A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry supply device is disposed on the polishing table to supply the slurry. In addition, the wafer carrier is disposed the polishing table to carry the wafer in such a manner that the wafer is brought into contact with the polishing pad. Besides, the high-pressure cleaning device is disposed on the polishing table to remove the impurities on the polishing pad by high-pressure liquid.