Invention Application
- Patent Title: High temperature pressure sensing system
- Patent Title (中): 高温压力传感系统
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Application No.: US11234724Application Date: 2005-09-23
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Publication No.: US20070068267A1Publication Date: 2007-03-29
- Inventor: Anthony Kurtz , Wolf Landmann , Alexander Ned
- Applicant: Anthony Kurtz , Wolf Landmann , Alexander Ned
- Main IPC: G01L9/06
- IPC: G01L9/06

Abstract:
A high temperature pressure sensing system (transducer) including: a pressure sensing piezoresistive sensor formed by a silicon-on-insulator (SOI) process; a SOI amplifier circuit operatively coupled to the piezoresistive sensor; a SOI gain controller circuit including a plurality of resistances that when selectively coupled to the amplifier adjust a gain of the amplifier; a plurality of off-chip contacts corresponding to the resistances, respectively, for electrically activating the corresponding resistances and using a metallization layer for the SOI sensor and SOI ASIC suitable for high temperature interconnections (bonding); wherein the piezoresistive sensor, amplifier circuit and gain control circuit are suitable for use in environments having a temperature greater than 175 degrees C. and reaching between 250° C. and 300° C., and wherein the entire transducer has a high immunity to nuclear radiation.
Public/Granted literature
- US07231828B2 High temperature pressure sensing system Public/Granted day:2007-06-19
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