Invention Application
- Patent Title: Wafer bonding compatible with bulk micro-machining
- Patent Title (中): 晶圆焊接兼容大容量微加工
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Application No.: US10548134Application Date: 2004-03-05
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Publication No.: US20070072330A1Publication Date: 2007-03-29
- Inventor: Dan Popa , Byoung Kang , Jian-Qiang Lu , Taejoo Hwang , Eric Leonard , Harry Stephanou
- Applicant: Dan Popa , Byoung Kang , Jian-Qiang Lu , Taejoo Hwang , Eric Leonard , Harry Stephanou
- Applicant Address: US NY Troy 12180-3590
- Assignee: Rensselaer Polytechnic Institute
- Current Assignee: Rensselaer Polytechnic Institute
- Current Assignee Address: US NY Troy 12180-3590
- International Application: PCT/US04/06826 WO 20040305
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for forming a microstructure is disclosed in which, after a polymer substance has been applied to a first substrate, the first substrate is micromachined to remove at least one portion of the first substrate. A second substrate is then adhered to the first substrate via the polymer substance. One application of such a method is in the fabrication of three-dimensional microfluidics. The polymer substance may, for example, be benzocyclobutene (BCB), and the first substrate may, for example, be a silicon wafer or a photo-etchable glass.
Information query
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