A pad is adapted for selectively receiving a first surface mounted component (SMC) and a second SMC on a printed circuit board. The first SMC and the second SMC include a number of footprints respectively. The pad includes a first portion for receiving the first SMC, a second portion for receiving the second SMC. Configurations and sizes of the first portion and the second portion are same with the ones of the footprints of the first SMC and the second SMC respectively. The second portion is overlapped with the first portion. The pad can selectively receive one of the first SMC and the second SMC.