发明申请
- 专利标题: System and method for compensating for thermal expansion of lithography apparatus or substrate
- 专利标题(中): 用于补偿光刻设备或基板的热膨胀的系统和方法
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申请号: US11257398申请日: 2005-10-25
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公开(公告)号: US20070075315A1公开(公告)日: 2007-04-05
- 发明人: Willem Venema , Johannes Baselmans
- 申请人: Willem Venema , Johannes Baselmans
- 申请人地址: NL Veldhoven
- 专利权人: ASML Netherlands B.V.
- 当前专利权人: ASML Netherlands B.V.
- 当前专利权人地址: NL Veldhoven
- 主分类号: H01L29/04
- IPC分类号: H01L29/04 ; H01L29/15 ; H01L31/036 ; H01L21/84 ; H01L21/00
摘要:
To prevent a substrate from expanding significantly to generate overlay errors an exposure operation takes place in two parts. A first part exposes boundary areas and a second part exposes the larger, bulk areas. In one example, a portion of the substrate is fixed and the substrate is exposed progressively from parts furthest from the fixed portions towards the fixed portion. In another example, a plurality of high velocity scans take place instead of a single slow scan, and the substrate is allowed to cool between the high velocity scans. In another example, a lithographic apparatus is heated in order to maintain a temperature differential between the apparatus and the surrounding environment, and to minimize any fluctuation due to the exposing radiation.