发明申请
- 专利标题： EMI SHIELDING DEVICE FOR PCB
- 专利标题（中）： 用于PCB的EMI屏蔽装置
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申请号： US11309270申请日： 2006-07-21
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公开(公告)号： US20070075418A1公开(公告)日： 2007-04-05
- 发明人: Chun-Hung Chen
- 申请人： Chun-Hung Chen
- 申请人地址： TW Taipei Hsien
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： TW Taipei Hsien
- 优先权： CN200510037136.0 20050905
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/10 ; H01L21/00
摘要：
A shielding device is provided for reducing EMI for a PCB. The shielding device includes a plurality of conductive grounded portions arranged on the PCB, an insulating mask, and an auxiliary grounded layer. A plurality of through holes is defined in the insulating mask corresponding to the grounded portions. The auxiliary grounded layer provides a conductive surface. The grounded portions contact the conductive surface via the through holes.
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IPC分类:
