发明申请
US20070077752A1 Rework process for removing residual UV adhesive from C4 wafer surfaces
有权
从C4晶圆表面去除残余UV粘合剂的返工工艺
- 专利标题： Rework process for removing residual UV adhesive from C4 wafer surfaces
- 专利标题（中）： 从C4晶圆表面去除残余UV粘合剂的返工工艺
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申请号： US11243882申请日： 2005-10-04
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公开(公告)号： US20070077752A1公开(公告)日： 2007-04-05
- 发明人: Steven Codding , Timothy Krywanczyk , Edmund Sprogis , Jocelyn Sylvestre , Matthew Whalen
- 申请人： Steven Codding , Timothy Krywanczyk , Edmund Sprogis , Jocelyn Sylvestre , Matthew Whalen
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; G03C5/00
摘要：
A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.
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