发明申请
- 专利标题: Bonded multi-layer RF window
- 专利标题(中): 保税多层射频窗口
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申请号: US11445559申请日: 2006-06-02
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公开(公告)号: US20070079936A1公开(公告)日: 2007-04-12
- 发明人: Maocheng Li , John Holland , Patrick Leahey , Xueyu Qian , Michael Barnes , Jon Clinton , You Wang , Nianci Han
- 申请人: Maocheng Li , John Holland , Patrick Leahey , Xueyu Qian , Michael Barnes , Jon Clinton , You Wang , Nianci Han
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: B31B1/60
- IPC分类号: B31B1/60 ; C23F1/00 ; C23C16/00
摘要:
A bonded multi-layer RF window may include an external layer of dielectric material having desired thermal properties, an internal layer of dielectric material exposed to plasma inside a reaction chamber, and an intermediate layer of bonding material between the external layer and the internal layer. Heat produced by the chemical reaction inside the chamber and by the transmission of RF energy through the window may be conducted from the internal layer to the external layer, which may be cooled during a semiconductor wafer manufacturing process. A bonded multi-layer RF window may include cooling conduits for circulating coolant to facilitate cooling of the internal layer; additionally or alternatively, gas distribution conduits and gas injection apertures may be included for delivering one or more process gases into a reaction chamber. A system including a plasma reaction chamber may employ the inventive bonded multi-layer RF window.