Invention Application
- Patent Title: Adhesive tape joining apparatus
- Patent Title (中): 胶带接合装置
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Application No.: US11541729Application Date: 2006-10-03
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Publication No.: US20070079939A1Publication Date: 2007-04-12
- Inventor: Osamu Degawa , Shinsuke Ikishima
- Applicant: Osamu Degawa , Shinsuke Ikishima
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Priority: JPJP2005-291158 20051004; JPJP2006-061203 20060307
- Main IPC: B44C7/00
- IPC: B44C7/00
Abstract:
A separator guide face for guiding a separator which is peeled off an adhesive tape at a region where the tape is wound of a tape supply roller in a direction different from a tape joining and moving direction is formed on a separator guide arranged to be opposed to a tape supply roller, and the separator guide can be changed between a posture for a separator guiding operation posture opposed to the tape supply roller and a release posture which is largely separated from the tape supply roller 12.
Information query
