发明申请
- 专利标题: Method and apparatus for flag-less water bonding tool
- 专利标题(中): 无标签水粘合工具的方法和装置
-
申请号: US11581065申请日: 2006-10-13
-
公开(公告)号: US20070087531A1公开(公告)日: 2007-04-19
- 发明人: Harry Kirk , Francois Henley , Philip Ong
- 申请人: Harry Kirk , Francois Henley , Philip Ong
- 申请人地址: US CA San Jose
- 专利权人: Silicon Genesis Corporation
- 当前专利权人: Silicon Genesis Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L21/30
- IPC分类号: H01L21/30 ; H01L21/46
摘要:
Embodiments in accordance with the present invention relate to methods and apparatuses for bonding together substrates in a manner that suppresses the formation of voids between them. In a specific embodiment, a backside of each substrate is adhered to a front area of flexible, porous chuck having a rear area in pneumatic communication with a vacuum. Application of the vacuum causes the chuck and the associated substrate to slightly bend. Owing to this bending, physical contact between local portions on the front side of the flexed substrates may be initiated, while maintaining other portions on front side of the substrates substantially free from contact with each other. A bond wave is formed and maintained at a determined velocity to form a continuous interface joining the front sides of the substrates, without formation of voids therebetween. In one embodiment, the chucks may comprise porous polyethylene sealed with polyimide except for a portion of the front configured to be in contact with the substrate, and a portion of the backside configured to be in communication with a vacuum source.
公开/授权文献
- US07479441B2 Method and apparatus for flag-less water bonding tool 公开/授权日:2009-01-20