发明申请
US20070089858A1 Waterblock for cooling electrical and electronic circuitry
审中-公开
Waterblock用于冷却电气和电子电路
- 专利标题： Waterblock for cooling electrical and electronic circuitry
- 专利标题（中）： Waterblock用于冷却电气和电子电路
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申请号： US11257669申请日： 2005-10-25
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公开(公告)号： US20070089858A1公开(公告)日： 2007-04-26
- 发明人: John Andberg , Noriyuki Sugihara
- 申请人： John Andberg , Noriyuki Sugihara
- 主分类号： F28F7/00
- IPC分类号： F28F7/00
摘要：
A waterblock and accompanying cooling tube for carrying away heat generated by electrical or electronic components mounted on a circuit board or other substrate are disclosed. The cooling tube is attached to the waterblock by means of an adhesive or other suitable material, and is not positioned in a groove machined into the surface of the waterblock as has been done in past. The unique design of the waterblock and cooling tube eliminates the need to machine expensive grooves in the waterblock, thereby reducing manufacturing costs.
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