发明申请
- 专利标题: Silicon carbide semiconductor device and manufacturing method therefor
- 专利标题(中): 碳化硅半导体器件及其制造方法
-
申请号: US10581247申请日: 2004-12-01
-
公开(公告)号: US20070090370A1公开(公告)日: 2007-04-26
- 发明人: Koji Nakayama , Yoshitaka Sugawara , Katsunori Asano , Hidekazu Tsuchida , Isaho Kamata , Toshiyuki Miyanagi , Tomonori Nakamura
- 申请人: Koji Nakayama , Yoshitaka Sugawara , Katsunori Asano , Hidekazu Tsuchida , Isaho Kamata , Toshiyuki Miyanagi , Tomonori Nakamura
- 优先权: JP2003-405259 20031203
- 国际申请: PCT/JP04/17888 WO 20041201
- 主分类号: H01L31/0312
- IPC分类号: H01L31/0312
摘要:
With a view to preventing increases in forward voltage due to a change with the lapse of time of a bipolar semiconductor device using a silicon carbide semiconductor, a buffer layer, a drift layer and other p-type and n-type semiconductor layers are formed on a growth surface, which is given by a surface of a crystal of a silicon carbide semiconductor having an off-angle θ of 8 degrees from a (000-1) carbon surface of the crystal, at a film growth rate having a film-thickness increasing rate per hour h of 10 μm/h, which is three times or more higher than conventional counterparts. The flow rate of silane and propane material gases and dopant gases is largely increased to enhance the film growth rate.
公开/授权文献
信息查询
IPC分类: