发明申请
- 专利标题: 3D Vision On A Chip
- 专利标题(中): 3D视觉芯片
-
申请号: US11612021申请日: 2006-12-18
-
公开(公告)号: US20070091175A1公开(公告)日: 2007-04-26
- 发明人: Gavriel Iddan , Giora Yahav
- 申请人: Gavriel Iddan , Giora Yahav
- 申请人地址: US IL Yokneam
- 专利权人: 3DV Systems Ltd.
- 当前专利权人: 3DV Systems Ltd.
- 当前专利权人地址: US IL Yokneam
- 主分类号: H04N13/02
- IPC分类号: H04N13/02 ; H04N7/18
摘要:
A 3D camera for determining distances to regions in a scene comprising: a photosurface having a plurality of pixels each of which comprises a circuit having a light sensitive element that provides a current responsive to light incident thereon, wherein the circuit comprises, at least one amplifier inside the pixel, having an input and an output; at least one feedback capacitor separate from the light sensitive element and connected between the input and output of each of the at least one amplifier; at least one controllable connection through which current flows from the light sensitive element into the input of the at least one amplifier; a light source; and, a controller that, controls the light source to illuminate the scene with light, opens and closes the at least one controllable connection to gate or modulate current from the light sensitive element of a pixel in the photosurface responsive to the time dependence of the gating or modulation of the light, controls the at least one controllable connection to provide a current for correcting biases caused by at least one of background light or dark current, and determines a distance to a region imaged on the pixel responsive to an amount of charge integrated on the feedback capacitor responsive to the gated or modulated current and the corrected biases.
公开/授权文献
- US08102426B2 3D vision on a chip 公开/授权日:2012-01-24
信息查询