发明申请
US20070092726A1 Encapsulated materials 审中-公开
封装材料

  • 专利标题: Encapsulated materials
  • 专利标题(中): 封装材料
  • 申请号: US10560212
    申请日: 2004-06-10
  • 公开(公告)号: US20070092726A1
    公开(公告)日: 2007-04-26
  • 发明人: Rudolfus Van Benthem
  • 申请人: Rudolfus Van Benthem
  • 申请人地址: NL TE Heerlen 6411
  • 专利权人: DSM IP ASSETS B.V.
  • 当前专利权人: DSM IP ASSETS B.V.
  • 当前专利权人地址: NL TE Heerlen 6411
  • 优先权: EP03076842.8 20030613
  • 国际申请: PCT/NL04/00412 WO 20040610
  • 主分类号: A61J3/07
  • IPC分类号: A61J3/07 B32B5/16
Encapsulated materials
摘要:
The invention relates to a process for forming capsules comprising the steps of: (1) forming a solution of an amino compound (1) in a solvent; (2) forming a dispersion of a core material in the solution;(3 depositing the amino compound as a resin upon the surface of the core material to form capsules; and (4) optionally hardening and/or recovering the capsules, whereby steps (1) and (2) are executed in either order or simultaneously, and wherein amino compound (1) has the following formula (I) where: X is O or NR5; EWG is an electron-withdrawing group; R1, R2, R3, R5 are equal to an H, alkyl, cycloalkyl, aryl of heterocycl group; and R1, R2, and R5 or R1, R2, and R3 may together form a heterocyclic group.
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