Invention Application
- Patent Title: Method for joining components
- Patent Title (中): 连接组件的方法
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Application No.: US11580875Application Date: 2006-10-16
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Publication No.: US20070095442A1Publication Date: 2007-05-03
- Inventor: Daniel Clark , John Webster
- Applicant: Daniel Clark , John Webster
- Priority: GB0521990.2 20051028
- Main IPC: C22F1/10
- IPC: C22F1/10

Abstract:
A method for joining components comprises locating a region, such as an end region 24, of a shape memory alloy (SMA) material component 10 adjacent to a further component 12, and generating localised plastic deformation of the aforesaid region to create a joint between the components 10, 12. The localised plastic deformation of the shape memory alloy material component 10 is preferably generated by applying a shock load to the shape memory alloy material component 10.
Public/Granted literature
- US07841060B2 Method for joining components Public/Granted day:2010-11-30
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