Invention Application
US20070095442A1 Method for joining components 有权
连接组件的方法

  • Patent Title: Method for joining components
  • Patent Title (中): 连接组件的方法
  • Application No.: US11580875
    Application Date: 2006-10-16
  • Publication No.: US20070095442A1
    Publication Date: 2007-05-03
  • Inventor: Daniel ClarkJohn Webster
  • Applicant: Daniel ClarkJohn Webster
  • Priority: GB0521990.2 20051028
  • Main IPC: C22F1/10
  • IPC: C22F1/10
Method for joining components
Abstract:
A method for joining components comprises locating a region, such as an end region 24, of a shape memory alloy (SMA) material component 10 adjacent to a further component 12, and generating localised plastic deformation of the aforesaid region to create a joint between the components 10, 12. The localised plastic deformation of the shape memory alloy material component 10 is preferably generated by applying a shock load to the shape memory alloy material component 10.
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