发明申请
- 专利标题： Structure and self-locating method of making capped chips
- 专利标题（中）： 制作封盖芯片的结构和自定位方法
-
申请号： US11641345申请日： 2006-12-19
-
公开(公告)号： US20070096312A1公开(公告)日： 2007-05-03
- 发明人: Giles Humpston , Belgacem Haba
- 申请人： Giles Humpston , Belgacem Haba
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A capped chip is provided in which a cap member has a bottom surface facing a front surface of the chip and a top surface opposite the front surface. A plurality of through holes is desirably provided in the cap member which extend from the bottom surface to the top surface. A plurality of metallic interconnects electrically connected to the chip are provided which project upwardly from the front surface of the chip at least partially through the through holes. Desirably, the metallic interconnects include stud bumps.
信息查询
IPC分类:
