发明申请
US20070098976A1 Method for fabricating conductive particle and anisotropic conductive film using the same
审中-公开
使用该方法制造导电粒子和各向异性导电膜的方法
- 专利标题: Method for fabricating conductive particle and anisotropic conductive film using the same
- 专利标题(中): 使用该方法制造导电粒子和各向异性导电膜的方法
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申请号: US11583863申请日: 2006-10-20
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公开(公告)号: US20070098976A1公开(公告)日: 2007-05-03
- 发明人: Mi-Jung Lee , Sung-Jei Hong , Won-Keun Kim , Jeong-In Han
- 申请人: Mi-Jung Lee , Sung-Jei Hong , Won-Keun Kim , Jeong-In Han
- 专利权人: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- 当前专利权人: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- 优先权: KRKR10-2005-0102912 20051031
- 主分类号: B05D7/00
- IPC分类号: B05D7/00 ; B32B5/16
摘要:
The present invention relates to a method for fabricating a conductive particle, the method comprising steps of: (a) preparing a particle based on a macromolecular resin; (b) forming a layer of a nano powder on a surface of the particle; and (c) subjecting the layer of the nano powder to an electroless plating. In accordance with the present invention, a nano powder is bonded on a particle based on a macromolecular resin and an electroless conductive layer is plated such that a pretreatment process of a plating process for forming a conductive particle is omitted and the plating process is simplified from twice to once, thereby reducing a toxic substance generated in a conventional process to improve a stability of the process and reduce a manufacturing cost.
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