发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US11610327申请日： 2006-12-13
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公开(公告)号： US20070099409A1公开(公告)日： 2007-05-03
- 发明人: Ichiro Mihara , Takeshi Wakabayashi , Toshihiro Kido , Hiroyasu Jobetto , Yutaka Yoshino , Nobuyuki Kageyama , Daita Kohno , Jun Yoshizawa
- 申请人： Ichiro Mihara , Takeshi Wakabayashi , Toshihiro Kido , Hiroyasu Jobetto , Yutaka Yoshino , Nobuyuki Kageyama , Daita Kohno , Jun Yoshizawa
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Casio Computer Co., Ltd.,CMK Corporation
- 当前专利权人： Casio Computer Co., Ltd.,CMK Corporation
- 当前专利权人地址： JP Tokyo JP Tokyo
- 优先权： JP2003-008551 20030116; JP2003-008552 20030116
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
公开/授权文献
- US07445964B2 Semiconductor device and method of manufacturing the same 公开/授权日：2008-11-04