发明申请
- 专利标题： Multi-chip assembly with optically coupled die
- 专利标题（中）： 具有光耦合模的多芯片组装
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申请号： US11270271申请日： 2005-11-09
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公开(公告)号： US20070102733A1公开(公告)日： 2007-05-10
- 发明人: Qing Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Zeng
- 申请人： Qing Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Zeng
- 主分类号： H01L29/768
- IPC分类号： H01L29/768
摘要：
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
公开/授权文献
- US07564066B2 Multi-chip assembly with optically coupled die 公开/授权日：2009-07-21
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