发明申请
US20070102816A1 Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof
有权
板结构，球栅阵列（BGA）封装及其方法以及焊球及其方法
- 专利标题： Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof
- 专利标题（中）： 板结构，球栅阵列（BGA）封装及其方法以及焊球及其方法
-
申请号： US11431703申请日： 2006-05-11
-
公开(公告)号： US20070102816A1公开(公告)日： 2007-05-10
- 发明人: Shin Kim
- 申请人： Shin Kim
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2005-0106358 20051108
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.
公开/授权文献
- US07791195B2 Ball grid array (BGA) package and method thereof 公开/授权日：2010-09-07