Invention Application
US20070102816A1 Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof
有权
板结构，球栅阵列（BGA）封装及其方法以及焊球及其方法
- Patent Title: Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof
- Patent Title (中): 板结构，球栅阵列（BGA）封装及其方法以及焊球及其方法
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Application No.: US11431703Application Date: 2006-05-11
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Publication No.: US20070102816A1Publication Date: 2007-05-10
- Inventor: Shin Kim
- Applicant: Shin Kim
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2005-0106358 20051108
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.
Public/Granted literature
- US07791195B2 Ball grid array (BGA) package and method thereof Public/Granted day:2010-09-07
Information query
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