发明申请
US20070102826A1 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same
审中-公开
具有至少一个半导体芯片和倒装片触点的电子部件及其制造方法
- 专利标题： Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same
- 专利标题（中）： 具有至少一个半导体芯片和倒装片触点的电子部件及其制造方法
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申请号： US11619086申请日： 2007-01-02
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公开(公告)号： US20070102826A1公开(公告)日： 2007-05-10
- 发明人: Georg Meyer-Berg , Barbara Vasquez
- 申请人： Georg Meyer-Berg , Barbara Vasquez
- 申请人地址： DE Munich 81669
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Munich 81669
- 优先权： DE10215654.9 20020409
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.
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