A plurality of conductive patterns constituting first, second, and third inductors are formed in a multi-layer wiring board. A fifth dielectric layer is disposed between second to fourth dielectric layers having the first inductor and a seventh dielectric layer having the second inductor. First and second electrode layers are disposed facing each other across the fifth dielectric layer so as to constitute a capacitor. The capacitor is disposed between the first and third inductors and the second inductor. The first electrode layer, i.e., one electrode of the capacitor, is a ground layer.