发明申请
US20070104973A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
审中-公开
低温固化粘合剂和使用其的各向异性导电粘合剂膜
- 专利标题： Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
- 专利标题（中）： 低温固化粘合剂和使用其的各向异性导电粘合剂膜
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申请号： US11514192申请日： 2006-09-01
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公开(公告)号： US20070104973A1公开(公告)日： 2007-05-10
- 发明人: Masao Saito , Osamu Takamatsu , Takayuki Matsushima
- 申请人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
- 申请人地址： JP Tochigi
- 专利权人： Sony Chemicals Corporation
- 当前专利权人： Sony Chemicals Corporation
- 当前专利权人地址： JP Tochigi
- 优先权： JP11-228101 19990812
- 主分类号： B32B27/30
- IPC分类号： B32B27/30 ; B32B33/00 ; C08F30/08
摘要：
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
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