发明申请
US20070105315A1 Method for producing distinct first and second active semi-conducting zones and use thereof for fabricating C-MOS structures
有权
用于制造不同的第一和第二有源半导体区的方法及其用于制造C-MOS结构的方法
- 专利标题: Method for producing distinct first and second active semi-conducting zones and use thereof for fabricating C-MOS structures
- 专利标题(中): 用于制造不同的第一和第二有源半导体区的方法及其用于制造C-MOS结构的方法
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申请号: US11584635申请日: 2006-10-23
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公开(公告)号: US20070105315A1公开(公告)日: 2007-05-10
- 发明人: Jean-Charles Barbe , Laurent Clavelier , Benoit Vianay , Yves Morand
- 申请人: Jean-Charles Barbe , Laurent Clavelier , Benoit Vianay , Yves Morand
- 申请人地址: FR PARIS FR MONTROUGE
- 专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE,STMICROELECTRONICS SA
- 当前专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE,STMICROELECTRONICS SA
- 当前专利权人地址: FR PARIS FR MONTROUGE
- 优先权: FR0511424 20051109
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method according to the invention enables first and second active zones to be produced on a front face of a support, which said zones are respectively formed by first and second monocrystalline semi-conducting materials that are distinct from one another and preferably have identical crystalline structures. The front faces of the first and second active zones also present the advantage of being in the same plane. Such a method consists in particular in producing the second active zones by a crystallization step of the second semi-conducting material in monocrystalline form, from patterns made of second semi-conducting material in polycrystalline and/or amorphous form and from interface regions between said patterns and preselected first active zones. Moreover, the support is formed by stacking of a substrate and of an electrically insulating thin layer, the front face of the electrically insulating thin layer forming the front face of the support.
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