An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.