发明申请
- 专利标题： Chip stack package and manufacturing method thereof
- 专利标题（中）： 芯片堆叠封装及其制造方法
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申请号： US11502427申请日： 2006-08-11
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公开(公告)号： US20070108574A1公开(公告)日： 2007-05-17
- 发明人: In-Ku Kang , Pyoung-Wan Kim
- 申请人： In-Ku Kang , Pyoung-Wan Kim
- 优先权： KR2005-73720 20050811
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A chip stack package may include a package substrate, a plurality of semiconductor chips mounted on the package substrate, bonding wires electrically connecting the semiconductor chips to the package substrate, and spacers interposed between the adjacent semiconductor chips. Each of the spacers may include a plurality of metal bumps. The spacers may be higher than the highest point of the bonding wire from the active surface of the semiconductor chip.
公开/授权文献
- US07521810B2 Chip stack package and manufacturing method thereof 公开/授权日：2009-04-21
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