发明申请
- 专利标题： Composite wiring board and manufacturing method thereof
- 专利标题（中）： 复合布线板及其制造方法
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申请号： US11595979申请日： 2006-11-13
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公开(公告)号： US20070108586A1公开(公告)日： 2007-05-17
- 发明人: Hiroyuki Uematsu , Toshinobu Miyakoshi , Hisashi Kobuke
- 申请人： Hiroyuki Uematsu , Toshinobu Miyakoshi , Hisashi Kobuke
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-329337 20051114; JP2006-015652 20060124
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A composite wiring board includes a ceramic substrate, a resin layer in contact with at least one surface of the ceramic substrate and a sintered metal conductor piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet having a shrinkage-suppressing effect and filling the through hole with conductive paste to obtain a sheet for formation of a conductor, firing the conductor formation sheet and a green sheet for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor, removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer on the surface of the ceramic substrate.