发明申请
- 专利标题: Semiconductor device with integrated heat spreader
- 专利标题(中): 带集成散热器的半导体器件
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申请号: US11274139申请日: 2005-11-16
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公开(公告)号: US20070108595A1公开(公告)日: 2007-05-17
- 发明人: Gamal Refai-Ahmed
- 申请人: Gamal Refai-Ahmed
- 专利权人: ATI Technologies Inc.
- 当前专利权人: ATI Technologies Inc.
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
A semiconductor device includes a die, a substrate, a heat spreader and a plurality of signal interconnects extending from the die. The heat spreader has a base and a plurality of fins. The heat spreader is mounted on the substrate in such a way that the base of the head spreader is in thermal communication with the die. The fins protrude downwardly into the substrate conducting heat away from the die and into the substrate.