发明申请
- 专利标题： STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM
- 专利标题（中）： 堆叠式集成电路包装系统
-
申请号： US11306805申请日： 2006-01-11
-
公开(公告)号： US20070108604A1公开(公告)日： 2007-05-17
- 发明人: Choong Bin Yim
- 申请人： Choong Bin Yim
- 申请人地址： SG Singapore
- 专利权人： STATS CHIPPAC LTD.
- 当前专利权人： STATS CHIPPAC LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.
公开/授权文献
- US07446396B2 Stacked integrated circuit leadframe package system 公开/授权日：2008-11-04