发明申请
- 专利标题： MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 安装基板和半导体器件
-
申请号： US11560076申请日： 2006-11-15
-
公开(公告)号： US20070108628A1公开(公告)日： 2007-05-17
- 发明人: Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
- 申请人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
- 申请人地址： JP Nagano-shi 381-2287
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP Nagano-shi 381-2287
- 优先权： JP2005-331708 20051116
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A mounting substrate for mounting a semiconductor chip in a flip chip manner, having a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern formed so as to cover a part of the connection pads, and a plurality of dummy patterns for controlling a flow of an underfill infiltrated below the semiconductor chip, characterized in that the plurality of dummy patterns are arranged in staggered lattice shape.
公开/授权文献
- US07838998B2 Mounting substrate and semiconductor device 公开/授权日：2010-11-23
信息查询
IPC分类:
