发明申请
- 专利标题: Printed circuit board and chip module
- 专利标题(中): 印刷电路板和芯片模块
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申请号: US11281688申请日: 2005-11-17
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公开(公告)号: US20070109726A1公开(公告)日: 2007-05-17
- 发明人: Wiren Becker , Bruce Chamberlin , Roland Frech , Andreas Huber , George Katopis , Erich Klink , Andreas Rebmann , Thomas-Michael Winkel
- 申请人: Wiren Becker , Bruce Chamberlin , Roland Frech , Andreas Huber , George Katopis , Erich Klink , Andreas Rebmann , Thomas-Michael Winkel
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H02B1/00
- IPC分类号: H02B1/00
摘要:
The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a printed circuit board having an improved signal return path for basically all relevant signal layers at transitions between card, connector, module and chip while still holding the cross-section structure simple, it is proposed to establish a layer structure wherein a) a split voltage plane is located adjacent to one side of one of said reference planes and comprises conducting portions for all of said at least three different voltage levels in respective plane parts, and b) a signal layer being located adjacent to said reference planes.
公开/授权文献
- US07355125B2 Printed circuit board and chip module 公开/授权日:2008-04-08